EUV lithography is more complex and demanding than DUV.
Chinese companies, particularly SMEE, are still in early development stages, with patents filed but no practical machines close to high-volume capability. EUV machines require extreme precision.
Components like light sources and magnetic field generators are far from completion. Experts suggest it could take 10-20 years for China to achieve this level of technology under present circumstances, meaning high-volume EUVs are unlikely to be ready before 2030.
Yes, I'd like to offer a better reference than Reddit, but there is a decent trove of educated guesses here: https://www.reddit.com/r/Optics/comments/1aid4fy/how_long_until_china_develop_euv_litography/
Why do you think you're right?
Chinese companies face substantial barriers in producing advanced DUV photolithography equipment. This includes engineering requirements, supply chain dependencies, and IP challenges. Major companies like SMEE are still several generations behind DUV leaders, such as ASML and Nikon, and would need to bridge this gap in under two years. Moreover, export controls and geopolitical factors restrict access to components and technology needed for high-volume manufacturing (Chinese Lithography RAN…).
Why might you be wrong?
@Pramila mentions SSMB, which is still experimental and fraught with difficulties, but it could be an alternative path forward for the Chinese.